Samsung’s next-generation flagship chipset, the Exynos 2700, could adopt a new packaging design, according to a recent report. The company is reportedly planning to move away from Fan-Out Wafer-Level Packaging (FOWLP) technology for the upcoming SoC.
Fan-Out Wafer-Level Packaging (FOWLP), which Samsung has used since the Exynos 2400, reportedly helped improve thermal performance. However, the technology is said to have been less profitable for the company due to its complex and costly manufacturing process.
According to the report, which cites an industry official, Samsung plans to…
Source: GSMArena.com – Latest articles